Products
CUX™ Copper Sintering Paste for Die Attachment
Mitsuboshi Belting's Copper Sintering Paste for Die Attachment, developed by combining our expertise in copper paste and sintering paste technologies, exhibits excellent sintering performance in inert gas atmospheres and delivers high bonding reliability.
Unlike conventional approaches, it does not require hydrogen or formic acid atmospheres, enabling bonding under nitrogen atmospheres or vacuum conditions. In addition to Cu metallization surfaces, it can also be applied to Au and Ag metallization surfaces.
Features
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Bonding Under Inert Gas (N₂) or Vacuum Conditions
Bonding can be performed under nitrogen atmospheres or vacuum conditions without requiring reducing atmospheres such as hydrogen or formic acid. This contributes to process simplification and improved operational safety. -
Low-Temperature Sintering
Can be used in low temperature process of 230°C. -
High Bonding Reliability
Demonstrates excellent bonding reliability under the following evaluation conditions:・Solid copper substrate: 18 mm × 18 mm・Solid copper chip: 3 mm × 3 mm・Without resin molding・-55°C ↔ 150°C(Keep at low temperature and high temperature for 30 minutes each.)
Cross-Section Image
Sintering conditions：100℃, 10min, Air → 260℃, 10MPa, 5min, N₂
Specification
| Type | Resistivity | DSS (Die Shear Strength) |
Thermal Conductivity | Sintering Conditions | Applications |
|---|---|---|---|---|---|
| Y001 | <6μΩ·cm | >30 MPa (230℃, 10MPa, 5min, N₂) | >250 W/m·K | >10MPa, ≧230℃, >5min | Power devices (Die attach) |
Applications
For power semiconductor die-attaching and semiconductor module attaching
Caution
- The listed data represents typical values and does not guarantee performance or quality.
- Product specifications are subject to change without notice.
