Products
MDot™ Silver Sintering Pastes for Die Attachment
This is a sintering paste for semiconductor bonding that can be sintered at low temperatures and offers both high thermal conductivity and bonding reliability.
It can form a metal sintered layer that is resistant to deterioration even under high-temperature operating conditions where conventional solder materials are difficult to use, making it widely applicable in semiconductor packaging fields that demand high strength, high thermal conductivity, and high reliability.
Features
-
High Density and High Thermal Conductivity
Proprietary silver nanoparticles enable the formation of dense sintered layers with minimal voids, resulting in excellent thermal conductivity. -
Low-Temperature Sintering
Can be used in low temperature processes above 200°C.
Pressure-less bonding
Pressure bonding
Specification
Pressure-less Bonding
| Type | Resistivity | Sintering condition | DSS (Die Shear Strength) |
Thermal conductivity | Applications |
|---|---|---|---|---|---|
| S320 | <3.5 μΩ·cm | 50℃, 30～90 min ＋200～250℃, 60 min |
80 MPa | >200 W/m·K | Die Attachment for Power Devices, RF Devices, LEDs, and Laser Diodes |
Pressure Bonding
| Type | Resistivity | Sintering condition | DSS (Die Shear Strength) |
Thermal conductivity | Applications |
|---|---|---|---|---|---|
| S280 | <3 μΩ·cm | >10Mpa,250~300℃,2min | 100 MPa (300℃,10Mpa,2min) |
>250 W/m·K | Power Devices (Die Attachment) |
| S290 | <3 μΩ·cm | >10Mpa,250~300℃,2min | 100 MPa (300℃,10Mpa,2min) |
>250 W/m·K | Power Devices (Module Assembly) |
Application
Caution
- The listed data is representative values and does not guarantee performance or quality.
- Product specifications are subject to change without notice.
