Products
Cu Conductive Pastes
By screen printing on ceramic substrates and applying an appropriate firing process, highly reliable conductive films with excellent adhesion and conductivity can be formed.
We also offers contract services for screen printing and firing processes. We can handle not only the supply of paste but also processing.
Features
- Wide Firing Temperature Range
Compatible with firing temperatures ranging from 600°C to 900°C, enabling use under a wide variety of process conditions.
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Compliance with Environmental Regulations
Lead-free formulations compliant with RoHS, SVHC, and REACH requirements, providing excellent environmental performance. -
Viscosity Adjustment and Cofiring Compatibility
Viscosity can be adjusted to meet specific printing requirements and process conditions. Cofiring-compatible formulations are also available for integrated firing processes with ceramic substrates.
Specification
| Type | Viscosity (10rpm) (Pa・s) |
Coverage (cm²/g) |
Substrates | Recommended firing conditions | Remarks |
|---|---|---|---|---|---|
| DC014E | 100～300 | 70 | Al₂O₃ | 900℃, 10min, in N₂ | - |
| AMR03 | 200～400 | 90 | Al₂O₃, Glass | 650℃, 10min, in N₂ | For low-temperature firing |
| M22 | 200～400 | 70 | AlN | 900℃, 10min, in N₂ | - |
| M29 | 200～400 | 10 | AlN | 900℃, 10min, in N₂ | Applicable for fired film thickness starting from 7μm |
| DC014GL | 50～100 | 65 | - | 900℃, 10min, in N₂ | Does not contain adhesion components. |
| GL19 | 50～100 | 70 | - | 650℃, 10min, in N₂ | Does not contain adhesion components; suitable for low-temperature firing. |
Application
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Wiring Formation for LED Package Substrates (Alumina (Al₂O₃))
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Wiring Formation for Passive Components (Aluminum Nitride (AlN))
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Ceramic Heaters
Chip Resistors
Caution
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It should be fired in a nitrogen atmosphere.
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Please check the Material Safety Data Sheet (SDS) for each product.
