Products
High-temperature firing pastes
High-temperature firing pastes are electronic materials that form wiring patterns and electrode functions by printing a paste containing metal powders such as silver and copper, together with glass components, onto ceramic substrates and then firing at high temperatures.
Featuring excellent conductivity, adhesion, and durability, they contribute to the enhanced reliability of a wide range of electronic components, including passive components and thick-film circuits.
Mitsuboshi Belting offers a lineup of Conductive Pastes (Ag-based, Cu-based), Resistive Pastes, Glass Pastes, and Active Metal Pastes (CuAgTi-Based). Customization of properties such as viscosity and resistance is also available.
These materials are widely used in applications including chip resistors and ceramic heaters.
Features
- High Adhesion Strength
Maintains high adhesion strength and delivers reliable performance even after thermal shock testing.
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Excellent Durability
Provides high reliability under harsh operating environments, including resistance to heat, thermal shock, oxidation, sulfuration, and ion migration. -
Firing Temperature
High-temperature firing pastes are designed to be fired at temperatures ranging from 600°C to 900°C. -
Free of Environmentally Hazardous Substances
Environmentally friendly design that does not contain lead and other hazardous substances (RoHS, etc.). -
Compatible with Various Substrates
Suitable for a wide range of substrate materials, including alumina (Al₂O₃), aluminum nitride (AlN), and silicon nitride (Si₃N₄).
