Products
CuAgTi Active metal pastes
Our Active Metal Pastes are thick-film pastes based on active metal brazing alloy (CuAgTi), providing strong and reliable bonding to ceramic substrates.
In addition to alumina (Al₂O₃) and aluminum nitride (AlN), they can also be applied to silicon nitride (Si₃N₄), which is generally difficult to bond.
Furthermore, by printing a layer of copper paste over the active metal paste, ultra-thick conductive films can be formed.
By using this paste as a bonding layer, bonding of ceramic substrates and copper plates can also be realized.
Features
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Strong Adhesion Through Chemical Bonding
A strong chemically bonded layer is formed at the interface between the metal film and the ceramic substrate, providing excellent adhesion even to difficult-to-bond materials such as Si₃N₄ and AlN. This contributes not only to improved mechanical strength but also to enhanced long-term reliability. -
Excellent Heat Resistance, Thermal Shock Resistance, and Reliability
Designed to resist delamination under high-temperature environments and rapid temperature changes, these pastes maintain stable performance in demanding applications such as power devices and heat-dissipation substrates. -
Highly Reliable Metallized Films Through Copper Paste Lamination
By laminating copper paste over the active metal paste, thick conductive films (metallized films) with excellent electrical and thermal conductivity can be formed. This enables thicker metallized films while maintaining strong adhesion to the substrate and contributes to improved thermal management. -
Environmentally Friendly, Pb- and Cd-Free Formulation
Formulated without hazardous substances such as lead (Pb) and cadmium (Cd), making it suitable for applications requiring compliance with environmental regulations, including those in Europe. This material can be handled safely while reducing environmental impact. -
Suitable for Mass Production Using Standard Continuous N₂ Furnaces
It does not require special equipment and can be mass-processed in a conventional N₂ atmosphere continuous furnace.
It is easy to introduce into existing lines and contributes to reducing manufacturing costs. -
Direct Bonding of Ceramic Substrates and Cu PlatesCan also be used as a bonding material for ceramic substrates and Cu plates.
(2) AlN Substrate
Cu Plate Bonding
(1) Cu Plate
(2) Active Metal Paste Bonding Layer
(3) AlN Substrate
Specification
| Type | Conductive Components | Adhesive Strength (N/2mm□) |
Recommended Firing Conditions | Coating Method | Substrates |
|---|---|---|---|---|---|
| AS110 | Ag, Cu, Ti | ≧30 | 850℃, 10min, in N₂ | Screen Printing | Al₂O₃, AlN, Si₃N₄ |
| AS112 | Ag, Cu, Ti | ≧30 | 850℃, 10min, in N₂ | Screen Printing | Al₂O₃, AlN, Si₃N₄ |
Application
- AS110
For Cu paste laminate: thick film conductor wiring and electrode formation (bonding layer with ceramic substrate) - AS112
For Cu Plate Joining: Joining between Copper and Ceramic Substrates
Caution
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It should be fired in a nitrogen atmosphere.
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Please check the Material Safety Data Sheet (SDS) for each product.
