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  5. CuNi Resistive Pastes

Products

CuNi Resistive Pastes

It is a base metal thick film resistive paste of CuNi system and maintains a stable resistance value even after firing.
It can accommodate a resistance range of 1 to 10 Ω, and when used together with our lineup of Cu conductive paste and Glass paste, it enables the formation of a more reliable fired film. Additionally, our company also accepts contract processing such as paste printing and firing on substrates, so please feel free to contact us.

Features

  • Low TCR, Ideal for High-Precision Chip Resistors
    These CuNi-based resistive pastes are suitable for current sensing and power management chip resistors. With a low temperature coefficient of resistance (TCR), they can meet demanding accuracy requirements of up to ±100 ppm class.
  • Superior cost performance due to base metal(Cu/Ni)
    Compared with Ag/Pd alloy-based pastes, Cu/Ni pastes offer lower material costs, contributing to overall cost reduction.
  • Free of Environmentally Hazardous Substances
    Formulated without environmentally hazardous substances, including lead, and compliant with environmental regulations such as RoHS.

Specification

Series Type Sheet resistance
(Ω/□ @20μmt)
TCR (ppm/℃) Viscosity
(Pa・s)
Fired Thickness
(μmt)
Coverage (cm²/g) Recommended firing conditions
HTCR CTCR
DH CN01DH 10 +500±50 +520±50 30~50 18~20 55 900℃, 10min, in N₂
CN03DH 30 -100±50 -90±50 30~50 18~20 55 900℃, 10min, in N₂
D CNR10D 100 -90±50 -60±50 30~50 20~25 68 900℃, 10min, in N₂
CNR50D 500 -70±50 -40±50 30~50 20~25 76 900℃, 10min, in N₂
CN1R5D 1500 -50±50 -20±50 30~50 20~25 80 900℃, 10min, in N₂


The DH series can be blended with the D series to adjust the resistance value.



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Application

  • Current Sensing Chip Resistors
  • Power Management Chip Resistors
  • Ceramic Heaters
  • Other Ceramic Circuit Substrates with Resistive Elements

  Chip Resistors

Caution

  • Please check the Material Safety Data Sheet (SDS) for each product.