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  5. Glass pastes

Products

Glass Pastes

These Glass Pastes are highly heat-resistant protective coating materials designed for thick-film processes. They are highly compatible with our copper pastes and resistive pastes, providing stable adhesion and uniform film quality.
The formed glass protective film securely covers the electrode layer and the resistance layer, and prevents oxygen and moisture from entering, thereby suppressing oxidation degradation of the conductor and resistor for a long time.
Even in applications where resistive elements are exposed to temperatures of 300°C to 400°C, such as ceramic heaters, these materials deliver excellent reliability by minimizing cracking, delamination, and property changes.

Features

  • Low Residue Formation Under Nitrogen Atmospheres
    A clean and uniform protective film can be formed with very little residue during firing and minimal soot even under a nitrogen atmosphere.

Specification

Type Viscosity (10rpm)
(Pa・s)
Coverage
(cm²/g)
Substrates Insulation withstand Voltage Recommended Firing Conditions Coefficient of Thermal Expansion
OCG12 50~100 210 Al₂O₃ ≧1.5kV/t=100μm 900℃, 10min, in N₂ 4.5 ppm/k
OCG17 200~300 230 Al₂O₃ ≧2.5kV/t=100μm 900℃, 10min, in Air 5.8 ppm/k
OCG04 200~300 220 AlN ≧2.0kV/t=100μm 900℃, 10min, in Air 3.2 ppm/k


Application

  • Current Sensing Chip Resistors
  • Power Management Chip Resistors
  • Ceramic Heaters
  • Other Ceramic Circuit Substrates with Resistive Elements

  Chip Resistors

Caution

  • Please check the Material Safety Data Sheet (SDS) for each product.