Products
MDot™ Silver Nano Filler for Conductive Silver Pastes
These silver nanoparticles are produced using a unique synthesis method developed through over 20 years of research.
They exhibit excellent low-temperature sinterability and serve as sintering aids for various conductive pastes that require low resistance and high thermal conductivity at low temperatures.
Features
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Promotes Low-Temperature Sintering
Sintering readily progresses even at temperatures below 200°C, enabling lower resistivity and higher thermal conductivity in low-temperature processes that are difficult to achieve with conventional pastes. -
Excellent Dispersion Stability
Our unique particle surface control technology enables silver nanoparticles, which generally tend to aggregate, to be stably dispersed in solvents for an extended period. -
Contributes to High-Density Sintered Layers
By filling the spaces between larger Ag fillers , the silver nanoparticles contribute to the formation of a dense sintered structure.
Specification
| Series | Silver content | Particle Size (DLS) | Characteristics |
|---|---|---|---|
| CF3xx | ≦90 wt％ | 70～100 nm | General Purpose (Suitable for a Wide Range of Conductive Pastes) |
| CF4xx | ≦90 wt％ | 130～170 nm | For Die Attachment Pastes / Low Organic Content / Large Particle Size |
| CF6Dxx | ≦92 wt％ | 60～90 nm | For Die Attachment Pastes / Low Organic Content / Excellent Sintering Performance under N₂ Atmosphere |
| SP15xx | ≦87 wt％ | 30～50 nm | Conductive Additive for Inkjet Inks and Rechargeable Battery Electrodes |
Supplied as pastes or slurries dispersed in solvents. Product codes (indicated by “xx”) vary depending on the dispersion solvent used.
Examples of solvents that have been dispersed :
Ethyl Carbitol, Butyl Carbitol Acetate, Butyl Carbitol, Terpineol, Isophorone, Dihydroterpineol, Liquid Epoxy, Acrylate Monomer, Carbitol Acetate
Application
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Conductive Pastes for Wiring Formation
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Conductive Adhesives
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Die Attachment Pastes
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Conductive Pastes for Internal Electrode Formation in Passive Components
Caution
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To ensure dispersion stability and quality stability, we provide paste slurry dispersed in solvent or liquid resin.
