Products
MDot™ Conductive Silver Pastes for Passive Components
This is a thermosetting conductive paste for conductive polymer tantalum solid electrolytic capacitors, suitable for use in electrodes (dipping) and lead frame bonding(dispensing).
We offer a lineup including low-resistance (low ESR) and low-silver-content products, contributing to reduced resistance, cost savings, and improved handling performance.
Features
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Low Resistivity
Our conductive silver pastes exhibit low resistivity and provide excellent electrical conductivity as electrode materials. -
Customizable Formulations
Formulations can be customized to meet specific customer requirements and application needs.
Specification
| Type | Coating method | Sintering condition | Resistivity | Characteristics | Applications |
|---|---|---|---|---|---|
| EC298 | Dipping | 170～200℃, 10～30 min | 50μΩ·cm | Low ESR | Tantalum Capacitors (electrode) |
| EC304 | Dipping | 120～200℃, 10～60 min | 10μΩ·cm | Low ESR | Tantalum Capacitors (electrode) |
| S5197 | Dispensing | 170℃, 30 min | 60μΩ·cm | Low ESR | Tantalum Capacitors (lead frame bonding) |
| S5200 | Dispensing | 170℃, 30 min | 80μΩ·cm | Low Silver Content | Tantalum Capacitors (lead frame bonding) |
Application
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Passive Components, Including Tantalum Capacitors
Caution
- The listed data is representative values and does not guarantee performance or quality.
- Product specifications are subject to change without notice.
