Products
MDot™ Conductive Silver Pastes and Inks for Printed Electronics
By applying silver nanoparticle technology with excellent low-temperature sinterability, we enable printing and inkjet circuit formation at low temperatures, contributing to the industrial implementation of printed electronics.
Features
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Customizable for Various Applications
Concentration and viscosity can be tailored to specific application requirements, enabling customization for desired device characteristics such as fine-line patterning, thick-film formation, and flexibility. These conductive pastes are suitable for a variety of printing methods, including screen printing and inkjet printing. -
Excellent Conductivity with Low-Temperature Processing
Delivers excellent electrical conductivity with low-temperature heating at 200°C or below.
Specification
| Type | Coating method | Recommended heating conditions | Resistivity | Characteristics |
|---|---|---|---|---|
| EC293 | Screen printing・Dispensing | 100～150℃, 30～60 min | < 10 μΩ·cm | Suitable for Low-Temperature Processing and Polycarbonate Substrates |
| EC242 | Screen printing・Dispensing | 120～180℃, 30～60 min | < 20 μΩ·cm | General Purpose with Excellent Flexibility |
| EC277 | Screen printing | 150～200℃, 30～60 min | < 8 μΩ·cm | Low Resistivity and Fine-Line Printing Capability |
| EC295 | Screen printing・Dispensing | 150～180℃, 30～60 min | < 20 μΩ·cm | Excellent Flexibility |
| EC261 | Screen printing | 200～250℃, 30～60 min | < 4 μΩ·cm | Low Resistivity, Suitable for Polyimide Substrates |
| SP15 | Inkjet printing | ＞100℃ | < 10 μΩ·cm | Inkjet Ink, Customizable Dispersion Solvent |
Application
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Wiring Formation on Film Substrates
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Wiring Formation on Glass and ITO Substrates
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Solar Cell Electrode Formation
Caution
- The listed data is representative values and does not guarantee performance or quality.
- Product specifications are subject to change without notice.
