Thick film solutions refer to technologies that form thick film layers by printing and firing thick film pastes—such as conductive, insulating, and resistive types—onto substrates, as well as to electronic components and circuit structures that utilize these technologies.
In the screen printing process, thick film materials (pastes) are printed onto ceramic substrates and then fired in a firing furnace to create electronic devices with excellent durability and reliability.
Mitsuboshi Belting’s copper pastes are optimized for this screen printing process and can form uniform and stable thick film copper patterns on substrates.