Products
Via-filling Solutions
Our Via filling solution is a comprehensive technical solution that includes materials and processes for filling vias in ceramic substrates such as aluminum nitride (AlN), alumina (Al₂O₃), and quartz—to provide double-sided conductivity and heat dissipation, thereby enhancing the design flexibility and reliability of circuits.
Mitsuboshi Belting offers extensive support, ranging from drilling holes in substrates to filling with copper or silver paste and polishing processes.
Features
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Stable Via Filling
By adopting a highly conductive, shrink-free filling method, uniform and stable filling is possible for various vias with different diameters and depths.Through the material design of the conductive paste and optimization of the filling process, shrinkage and voids after firing are suppressed, enabling dense filling inside the vias.This simultaneously achieves stable double-sided conductivity, improved electrical characteristics through reduced resistance, and enhanced heat dissipation by forming vertical thermal conduction paths, providing high electrical and thermal reliability. Recently, demand for large-sized and thin substrates has been increasing, and we have experience processing such substrates. -
One-Stop Process Support from Drilling to Finishing
Our system supports a wide range of processes, including drilling, via filling, and polishing, and can provide integrated solutions tailored to the application.By handling the pre- and post-processes necessary for via formation, it reduces quality variations caused by process segmentation, lessens the burden of managing multiple vendors, and enables a smooth transition from prototyping to mass production.
