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TOP ＞ Electronic Materials and Coating Materials ＞ Conductive Paste ＞ Silver Paste (Thermosetting type, Die attach)
Silver Paste (Thermosetting type
Conductive Paste

Silver Paste (Thermosetting type, Die attach)

    Silver paste containing our originally developed silver nanoparticles. It excels in sintering at low temperatures and achieves low resistance. We also have a lineup of conductive adhesives, which provide higher strength, higher heat resistance, and higher reliability compared to solder.

Catalog
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Specification Lineup

High thermal conductivity

High thermal conductivity, high strength, high reliability Die attach paste MDot S series (non-pressurized type)

High thermal conductivity

High thermal conductivity, high strength, high reliability Die attach paste MDot S series (pressure type)

Low temperature

Low temperature, low resistance MDot EC series for wiring and electrode formation

Low ESR ・ High reliability MDot EC and S series for wiring and electrode formation (for passive components)

Low ESR ・ High reliability MDot EC and S series for wiring and electrode formation (for passive components)

Precautions

・The data listed are representative values and do not guarantee performance or quality.
・Product specifications are subject to change without notice.

Remarks

・"MDot" is a trademark of Mitsuboshi Belting's silver-related products.
・We have a lineup of silver pastes for various applications other than the listed part numbers, and we can flexibly respond to various requests for adjusting applicability, etc. Please contact us for more information.