Silver paste containing our originally developed silver nanoparticles. It excels in sintering at low temperatures and achieves low resistance. We also have a lineup of conductive adhesives, which provide higher strength, higher heat resistance, and higher reliability compared to solder.
High thermal conductivity, high strength, high reliability Die attach paste MDot S series (non-pressurized type)
High thermal conductivity, high strength, high reliability Die attach paste MDot S series (pressure type)
Low temperature, low resistance MDot EC series for wiring and electrode formation
Low ESR ・ High reliability MDot EC and S series for wiring and electrode formation (for passive components)
・The data listed are representative values and do not guarantee performance or quality.
・Product specifications are subject to change without notice.
・"MDot" is a trademark of Mitsuboshi Belting's silver-related products.
・We have a lineup of silver pastes for various applications other than the listed part numbers, and we can flexibly respond to various requests for adjusting applicability, etc. Please contact us for more information.