Products

Active Metal Paste
Conductive Paste

Active Metal Paste

    Thick film paste using active metal solder AgCuTi for bonding to ceramic substrates. It can bond to ceramics such as alumina and aluminum nitride, as well as silicon nitride. Super-thick film conductor can be formed by layering copper paste on top of the active metal paste. It is also possible to bond ceramic substrates and copper plates using the active metal paste as the bonding layer.

Catalog
Contact us about this product

specification

・Nitrogen atmosphere modification supported
・High adhesion, high reliability
・Free of environmentally hazardous substances of lead (Pb).
・Baking temperature: 750-900℃.
・Cu thick film lamination (approx. 300 μm) is possible.(Thick film circuit board)

・Cross-sectional SEM image of a sample of copper plate bonded to a silicon nitride (Si3N4) substrate using active metal paste and its bonding surface

Features

・Compatible with nitrogen atmosphere sintering
・High adhesion and reliability.
・Contains no environmentally hazardous substances such as lead (Pb)

Assumed Applications

・Ceramic heat dissipation circuit package for power devices

Precautions

・Firing should be performed under a nitrogen atmosphere.
・Other handling precautions shall be in accordance with the Material Safety Data Sheet (SDS) for each product.

Remarks

・Commission firing is available. If you do not have a nitrogen displacement furnace, please let us know.