We provide ceramic substrates with surface metallization of various thick film materials including conductive paste. Steel components and specifications are also available upon request.
Alumina and aluminum nitride substrates are available. In addition to metallization, plating and resist formation are also available.
･Combined with our via filling technology, high quality double-sided conduction processing is possible.
･Does not contain environmentally hazardous substances such as lead (Pb).
・Chip resistor, Internal electrode formation
・LED-mounted circuit package substrate, Electrode formation
・Cold/heat modules (Peltier), Internal electrodes