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Products
Thick film circuit board
We provide ceramic substrates with surface metallization of various thick film materials including conductive paste. Steel components and specifications are also available upon request.
specification
Features
Alumina and aluminum nitride substrates are available. In addition to metallization, plating and resist formation are also available.
･Combined with our via filling technology, high quality double-sided conduction processing is possible.
･Does not contain environmentally hazardous substances such as lead (Pb).
Achievement・Assumed Applications
Achievement
・Chip resistor, Internal electrode formation
・LED-mounted circuit package substrate, Electrode formation
Assumed Applications
・Cold/heat modules (Peltier), Internal electrodes
