Products
Cushioning Material for Heat Press
Heat Press Cushioning Material is a heat-resistant cushioning material used during the hot-pressing processes involved in the manufacturing of electronic materials and electronic components.
It absorbs pressure variations and stress concentrations that can occur during heating and pressurization, ensuring uniform pressure distribution.
As a result, it helps prevent damage to substrates and components, maintain thickness accuracy, and stabilize bonding quality.
Widely used in manufacturing processes requiring high processing precision, it is suitable for applications such as printed circuit boards (PCBs), semiconductor-related materials, and flexible printed circuits (FPCs).
Features
-
Excellent Heat Resistance
Maintains stable physical properties even under high-temperature conditions. Resistant to softening and degradation during heating, it preserves its elasticity and thickness, enabling stable pressing conditions while minimizing thermal impact on products. -
High Durability
Delivers excellent durability under repeated heating and pressurization cycles and offers superior recovery after compression. Its resistance to permanent deformation helps maintain consistent cushioning performance over extended periods, contributing to process stability and reducing the frequency of consumable replacement. -
Uniform Pressure Distribution
With an optimized balance of elasticity and compressibility, it absorbs minor surface irregularities and height differences during pressing, ensuring uniform pressure distribution across the entire surface. By preventing localized stress concentration, it helps reduce substrate warpage, cracking, and bonding defects, thereby improving product quality and manufacturing yield.
