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Silver Paste (High-temperature firing type)
Conductive Paste

Silver Paste (High-temperature firing type)

    In addition to alumina and glass substrates, aluminum nitride substrates The feature of this product is its high adhesion and high reliability even for In addition, in order to suppress sulfurization and migration, which are drawbacks of Ag Ni/Au plating can also be applied. Screen printing, screen offset printing, and dip coating are available. We can propose pastes according to the application method. If you have any other requests, we can adjust the paste. Please feel free to contact us. We also offer paste printing on substrates.(Thick film circuit board)

Catalog
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Specification Lineup

Achievement

・Wiring formation for LED mounted circuit package substrate (alumina substrate)
・Wiring formation for passive components (aluminum nitride substrate)

Precautions

・The data listed are representative values and do not guarantee performance or quality.
・Product specifications are subject to change without notice.

Remarks

・"MDot" is a trademark of Mitsuboshi Belting's silver-related products.
・We have a lineup of silver pastes for various applications other than the listed part numbers, and we can flexibly respond to various requests for adjusting applicability, etc. Please contact us for more information.