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Copper Paste (High-temperature firing type)
Conductive Paste

Copper Paste (High-temperature firing type)

    After screen printing and sintering on ceramic substrates, conductors are formed with high adhesion and reliability. We also offer paste printing on substrates.(Thick film circuit board)

Catalog
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Features

Lineup includes alumina substrates, aluminum nitride substrates, and laminate thickeners (without adhesion components).
・Viscosity and thixotropy can be adjusted according to printing patterns.
・Firing film thickness is from 5 ?m~ and baking temperature is from 650℃.
・Does not contain environmentally hazardous substances such as lead (Pb).

Achievement・Assumed Applications

Achievements
・Chip resistors, internal electrode formation
・LED mounted circuit package substrates, electrode formation
・Assumed applications
・Cold/heat modules (Peltier), Internal electrodes

Precautions

・Firing should be performed under a nitrogen atmosphere.
・Other handling precautions shall be in accordance with the Material Safety Data Sheet (SDS) for each product.

Remarks

・ We accept commission firing.
・If you do not have a nitrogen displacement furnace, please let us know.
・We can also offer our resistance paste and glass paste with good matching.
・"CUX" is a trademark for Mitsuboshi Belting's copper-related products.